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Showing results 1 to 5 of 5

1
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

2
DNA Lipoplex-Based Light-Harvesting Antennae

Jo, Sung Duk; Kim, Jee Seon; Kim, Inhye; Yun, Jun Su; Park, Jae Chul; Koo, Bon Il; Lee, Eunji; et al, ADVANCED FUNCTIONAL MATERIALS, v.27, no.26, 2017-07

3
In situ ligand exchange of thiol-capped CuInS2/ZnS quantum dots at growth stage without affecting luminescent characteristics

Kim, Hyun-Ki; Suh, Min-Won; Kwon, Byoung-Hwa; Jang, Dong-Seon; Kim, Sung-Wook; Jeon, Duk-Young, JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.363, no.2, pp.703 - 706, 2011-11

4
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02

5
Water-resistant flexible GaN LED on a liquid crystal polymer substrate for implantable biomedical applications

Lee, Sang Yong; Park, Kwi-Il; Huh, Chul; Koo, Min; Yoo, Hyeon Gyun; Kim, Seungjun; Ah, Chil Seong; et al, NANO ENERGY, v.1, no.1, pp.145 - 151, 2012-01

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