Showing results 1 to 2 of 2
Dry film photoresist를 이용한 인쇄회로기판용 인듐 솔더 범프 형성 및 플립칩 패키지의 마이크로파 주파수 특성 측정 = Formation of indium solder bumps on printed circuit board using dry film photoresist and microwave frequency measurement of flip chip packagelink 이정섭; Lee, Jung-Sub; et al, 한국과학기술원, 2004 |
Water-resistant flexible GaN LED on a liquid crystal polymer substrate for implantable biomedical applications Lee, Sang Yong; Park, Kwi-Il; Huh, Chul; Koo, Min; Yoo, Hyeon Gyun; Kim, Seungjun; Ah, Chil Seong; et al, NANO ENERGY, v.1, no.1, pp.145 - 151, 2012-01 |
Discover