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Showing results 1 to 6 of 6

1
Accelerated mapping of electronic density of states patterns of metallic nanoparticles via machine-learning

Bang, Kihoon; Yeo, Byung Chul; Kim, Donghun; Han, Sang Soo; Lee, Hyuck-Mo, SCIENTIFIC REPORTS, v.11, no.1, 2021-06

2
Deep-learning based spatio-temporal generative model on assessing state-of-health for Li-ion batteries with partially-cycled profiles

Park, Seojoung; Lee, Hyunjun; Scott-Nevros, Zoe K. K.; Lim, Dongjun; Seo, Dong-Hwa; Choi, Yunseok; Lim, Hankwon; et al, MATERIALS HORIZONS, v.10, no.4, 2023-04

3
Effect of under bump metallurgy and reflows on shear strength and microstructure of joint between Cu substrate and Sn-36Pb-2Ag solder alloy

Yoon, SW; Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.44, no.2, pp.290 - 297, 2003-02

4
Microstructures and enhanced mechanical properties of an oxide dispersion -strengthened Ni-rich high entropy superalloy fabricated by a powder metallurgical process

Kong, Taeyeong; Kang, Byungchul; Ryu, Ho Jin; Hong, Soon Hyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.839, 2020-10

5
Thermodynamic issues of lead-free soldering in electronic packaging

Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003

6
Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies

Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04

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