Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Paik Kyung-Wook
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| Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF Yang, SY; Kwon, WS; Lee, SB; Paik Kyung-Wook, 5th International Symposium on Electronic Materials and Packagings 2003, 2003-11 |
| Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis Lee, BW; Jeong, JH; Jang, WS; Kim, JY; Kim, DW; Kwon, DI; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, Kyungpook National University, 2002-10 |
| Effects of Pd Addition on Au stud Bumps/Al Pads Interfacial Reactions and Bond Reliability Kim, HJ; Cho, JS; Park, YJ; Lee, J; Paik Kyung-Wook, TMS 2004 133rd Annual Meeting & Exhibition, TMS, 2004-03 |
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