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Showing results 39 to 43 of 43

39
THE EFFECT OF GLASS FRITS ON THE MICROSTRUCTURE AND ELECTRICAL-PROPERTIES OF BISMUTH RUTHENATE THICK-FILM RESISTORS

NAM, SH; Kim, Ho Gi, THIN SOLID FILMS, v.195, no.1-2, pp.43 - 51, 1991-01

40
The effect of plasma treatment on adsorbed iodine as a catalyst in chemical vapor deposition of copper and application to filling of deep trenches with high aspect ratios

Lee, Do-Seon; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.48, no.7, pp.076004-1 - 076004-6, 2009-07

41
Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp

Meitl, Mattew A; Zhu, Zheng-Tao; Kumar, Vipan; Lee, Keonjae; Feng, Xue; Huang, Yonggang Y; Adesida, Ilesanmi; et al, NATURE MATERIALS, v.5, no.1, pp.33 - 38, 2006-01

42
Transparent, thermally stable methyl siloxane hybrid materials using sol-gel synthesized vinyl-methyl oligosiloxane resin

Bae, Jun-Young; Jang, Junho; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.82, no.1, pp.253 - 260, 2017-04

43
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package

Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05

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