A Surface-Micromachined Capacitive Microphone With Improved Sensitivity

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We present a surface-micromachined capacitive microphone with a membrane center hole and back-plate supports. The proposed membrane center hole reduces air damping at the center of the membrane and increases the sensitivity and frequency response. The back-plate supports allow for a deep back-chamber and prevent deformation of the back-plate. The proposed microelectromechanical-system (MEMS) microphone is fabricated using fully CMOS-compatible processes. The fabricated MEMS microphone has a membrane 500 mu m in diameter and a center hole 30 mu m in diameter. A deep back-chamber with a depth of 100 mu m is formed by the back-plate supporting structures. During fabrication, the residual stress of the membrane is minimized using PECVD silicon nitride inserted in the metal membrane. The measured residual stress of the sensing membrane is 14.8 MPa. Acoustic measurements show that the sensitivity of the microphone is -49.1 dBV Pa-1 @1 kHz at a 12 V dc bias voltage, which is in good agreement with the calculated value.
Publisher
IOP PUBLISHING LTD
Issue Date
2013-05
Language
English
Article Type
Article
Keywords

CONDENSER MICROPHONE; MEMS

Citation

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.23, no.5

ISSN
0960-1317
DOI
10.1088/0960-1317/23/5/055018
URI
http://hdl.handle.net/10203/174767
Appears in Collection
BiS-Journal Papers(저널논문)
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