Performance Analysis of Vertical and Horizontal Transmitter Array Modules Using Short- and Long-Wavelength VCSELS for Optical Interconnects

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dc.contributor.authorUkaegbu, Ikechi Augustineko
dc.contributor.authorKim, Do-Wonko
dc.contributor.authorShirazy, Mohammed Shorab Muslimko
dc.contributor.authorLee, Tae-Wooko
dc.contributor.authorCho, Mu-Heeko
dc.contributor.authorPark, Hyo-Hoonko
dc.date.accessioned2013-08-08T06:00:18Z-
dc.date.available2013-08-08T06:00:18Z-
dc.date.created2013-06-24-
dc.date.created2013-06-24-
dc.date.issued2013-05-
dc.identifier.citationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.5, pp.740 - 748-
dc.identifier.issn2156-3950-
dc.identifier.urihttp://hdl.handle.net/10203/174732-
dc.description.abstractFor short- and long-wavelength vertical surface-emitting lasers (VCSELs), performances of optical transmitter array modules with vertically and horizontally packaged structures are analyzed for application to on-board optical interconnection. 850 and 1310 nm wavelengths are selected for the short- and long-wavelength light sources. For each wavelength, top- and bottom-emitting VCSELs are used to compare the performances of four different module structures: bottom-emitting types of 850 and 1310 nm for the vertical modules, and top- emitting types of 850 and 1310 nm for the horizontal modules. The horizontal transmitter modules are packaged using the conventional wire-bonding technology for the interconnect between VCSEL and driver chips while the vertical modules are packaged using the flip-chip-bonding technology. Signal crosstalk is investigated using 1 x 4 VCSEL array chips, which are driven using the same Si-CMOS circuits designed for 5 Gb/s operation. The vertical modules show lower crosstalk than the horizontal modules. When the gap distance between the VCSEL aperture and the waveguide input port increases up to 500 mu m for each module, the crosstalk increases in a range -58 to -37 dB. The 3-dB bandwidth performances are sensitively degraded in a range 4.6-2.0 GHz when the gap distance increases. In the crosstalk, the 1310-nm vertical module shows the best performance, while in the 3-dB bandwidth, the 850-nm horizontal module shows the best performance. The four modules shows clear eye openings at 2.5 Gb/s with bit error rate < 10(-12) and can be used for on-board optical interconnections.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectPRINTED-CIRCUIT BOARD-
dc.subjectSYSTEMS-
dc.titlePerformance Analysis of Vertical and Horizontal Transmitter Array Modules Using Short- and Long-Wavelength VCSELS for Optical Interconnects-
dc.typeArticle-
dc.identifier.wosid000318702100005-
dc.identifier.scopusid2-s2.0-84877250705-
dc.type.rimsART-
dc.citation.volume3-
dc.citation.issue5-
dc.citation.beginningpage740-
dc.citation.endingpage748-
dc.citation.publicationnameIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY-
dc.identifier.doi10.1109/TCPMT.2013.2248151-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPark, Hyo-Hoon-
dc.contributor.nonIdAuthorKim, Do-Won-
dc.contributor.nonIdAuthorShirazy, Mohammed Shorab Muslim-
dc.contributor.nonIdAuthorLee, Tae-Woo-
dc.contributor.nonIdAuthorCho, Mu-Hee-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorFlip-chip bonding-
dc.subject.keywordAuthorlong-wavelength VCSEL-
dc.subject.keywordAuthoroptical interconnection-
dc.subject.keywordAuthoroptical multichip module-
dc.subject.keywordAuthoroptical printed-circuit board (OPCB)-
dc.subject.keywordAuthorshort-wavelength VCSEL-
dc.subject.keywordAuthorSi-CMOS driver IC-
dc.subject.keywordPlusPRINTED-CIRCUIT BOARD-
dc.subject.keywordPlusSYSTEMS-
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