3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Choi, Yongwon | ko |
| dc.contributor.author | Shin, Jiwon | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-29T16:51:20Z | - |
| dc.date.available | 2013-03-29T16:51:20Z | - |
| dc.date.created | 2012-12-13 | - |
| dc.date.created | 2012-12-13 | - |
| dc.date.created | 2012-12-13 | - |
| dc.date.issued | 2012-05 | - |
| dc.identifier.citation | The 62nd Electronic Components and Technology Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/172283 | - |
| dc.language | English | - |
| dc.publisher | ECTC | - |
| dc.title | 3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs) | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000309162000173 | - |
| dc.identifier.scopusid | 2-s2.0-84866862222 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 62nd Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Choi, Yongwon | - |
| dc.contributor.nonIdAuthor | Shin, Jiwon | - |
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