3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs)

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Publisher
ECTC
Issue Date
2012-05
Language
ENG
Citation

The 62nd Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/172283
Appears in Collection
MS-Conference Papers(학술회의논문)
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