Ultrasonic-Assisted Thermo-Compression Bonding Method for High-Performance Solder Anisotropic Conductive Film (ACF) Joints

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dc.contributor.authorKim, Yoo-Sunko
dc.contributor.authorLee, Kiwonko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2013-03-29T07:55:49Z-
dc.date.available2013-03-29T07:55:49Z-
dc.date.created2012-06-21-
dc.date.created2012-06-21-
dc.date.created2012-06-21-
dc.date.issued2012-05-
dc.identifier.citationThe 62nd Electronic Components and Technology Conference-
dc.identifier.urihttp://hdl.handle.net/10203/169203-
dc.languageEnglish-
dc.publisherIEEE-
dc.titleUltrasonic-Assisted Thermo-Compression Bonding Method for High-Performance Solder Anisotropic Conductive Film (ACF) Joints-
dc.typeConference-
dc.identifier.wosid000309162000076-
dc.identifier.scopusid2-s2.0-84866868424-
dc.type.rimsCONF-
dc.citation.publicationnameThe 62nd Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKim, Yoo-Sun-
dc.contributor.nonIdAuthorLee, Kiwon-
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MS-Conference Papers(학술회의논문)
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