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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs

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Song, T / Liu, C / Kim, DH / Lim, SK / Cho, J / Kim, J / Pak, JS / Ahn, Seungyoung / Kim, Joung Horesearcher / Yoon, K
Publisher
ISQED 2011
Issue Date
2011-03-14
Language
English
Citation

12th International Symposium on Quality Electronic Design, ISQED 2011, pp.122 - 128

URI
http://hdl.handle.net/10203/164869
Appears in Collection
EE-Conference Papers(학술회의논문)
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