Multi-Stacking Through-Silicon-Via Effects on Signal Integrity and Power Integrity for Application of 3-Dimensional Stacked-Chip-Package
- Issue Date
- 2008
- Language
- ENG
- Citation
Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008)
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
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