DSpace at KOASAS: Thermodynamic Analysis of the Microstructural Change in Sn-rich Solders affected by their Interfacial Reaction with Cu or Ni(P) UBM

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Thermodynamic Analysis of the Microstructural Change in Sn-rich Solders affected by their Interfacial Reaction with Cu or Ni(P) UBM

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Lee, Hyuck Mo researcher

Issue Date: 2009-05-17

Language: ENG

Citation: 38th CALPHAD

URI: http://hdl.handle.net/10203/162565

Appears in Collection: MS-Conference Papers(학술회의논문)

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Thermodynamic Analysis of the Microstructural Change in Sn-rich Solders affected by their Interfacial Reaction with Cu or Ni(P) UBM

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