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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Inspection of ball grid array (BGA) solder joints using X-ray cross-sectional images

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Roh Y.J. / Ko K.W. / Cho, Hyungsuckresearcher / Kim H.C. / Joo H.N. / Kim S.K.
Publisher
International Society for Optical Engineering (SPIE)
Issue Date
1999-09-21
Language
ENG
Description

Copyright 1999 Society of Photo-Optical Instrumentation Engineers.

Citation

Proceedings of the 1999 Machine Vision Systems for Inspection and Metrology VIII, v.3836, pp.168 - 178

ISSN
0277-786X
URI
http://hdl.handle.net/10203/1607
Appears in Collection
ME-Conference Papers(학술회의논문)
Files in This Item
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