Passive packaging solutions using the fiber-optic technology for optical-PCB-based interconnection systems
- Publisher
- ECWC
- Issue Date
- 2008-03-15
- Language
- ENG
- Citation
Electronics Circuits World Convention (ECWC) 11, pp.0 - 0
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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