Heat sink design for a thermoelectric cooling system
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Han H.S. | - |
| dc.contributor.author | Kim S.Y. | - |
| dc.contributor.author | Ji T.H. | - |
| dc.contributor.author | Jee Y.-J. | - |
| dc.contributor.author | Lee D. | - |
| dc.contributor.author | Jang K.S. | - |
| dc.contributor.author | Oh D.H. | - |
| dc.date.accessioned | 2013-03-26T01:06:07Z | - |
| dc.date.available | 2013-03-26T01:06:07Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008-05-28 | - |
| dc.identifier.citation | 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM, v., no., pp.1222 - 1230 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/156618 | - |
| dc.language | ENG | - |
| dc.title | Heat sink design for a thermoelectric cooling system | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-50949104481 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1222 | - |
| dc.citation.endingpage | 1230 | - |
| dc.citation.publicationname | 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Han H.S. | - |
| dc.contributor.localauthor | Ji T.H. | - |
| dc.contributor.nonIdAuthor | Kim S.Y. | - |
| dc.contributor.nonIdAuthor | Jee Y.-J. | - |
| dc.contributor.nonIdAuthor | Lee D. | - |
| dc.contributor.nonIdAuthor | Jang K.S. | - |
| dc.contributor.nonIdAuthor | Oh D.H. | - |
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