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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

3D strip meander delay line structure for multilayer LTCC-based SiP applications

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dc.contributor.authorKim, G.-
dc.contributor.authorLu A.C.W.-
dc.contributor.authorWei, F.-
dc.contributor.authorWai, L.L.-
dc.contributor.authorKim, Joungho-
dc.date.accessioned2013-03-19T02:39:49Z-
dc.date.available2013-03-19T02:39:49Z-
dc.date.created2012-02-06-
dc.date.issued2008-05-27-
dc.identifier.citation2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.2081 - 2085-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/155012-
dc.languageENG-
dc.title3D strip meander delay line structure for multilayer LTCC-based SiP applications-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51349113489-
dc.type.rimsCONF-
dc.citation.beginningpage2081-
dc.citation.endingpage2085-
dc.citation.publicationname2008 58th Electronic Components and Technology Conference, ECTC-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorKim, G.-
dc.contributor.nonIdAuthorLu A.C.W.-
dc.contributor.nonIdAuthorWei, F.-
dc.contributor.nonIdAuthorWai, L.L.-
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EE-Conference Papers(학술회의논문)
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