Experimental verification and analysis for noise isolation of analog and digital chip-package-PCB hierarchical power distribution network
- Issue Date
- 2008-12-01
- Language
- ENG
- Citation
IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, pp.73 - 76
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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