Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM

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Issue Date
2008-05-27
Language
ENG
Citation

2008 58th Electronic Components and Technology Conference, ECTC, pp.360 - 365

ISSN
0569-5503
URI
http://hdl.handle.net/10203/154706
Appears in Collection
RIMS Conference Papers
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