Formation and characterization of cobalt-reinforced Sn-3.5Ag solder

Publisher
IEEE
Issue Date
2006-05-30
Language
ENG
Citation

IEEE 56th Electronic Components and Technology Conference, pp.244 - 249

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1515
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
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