Overview of the Electronic Packaging Technologies in Korea
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yu, Jin | - |
| dc.contributor.author | Sohn, YC | - |
| dc.contributor.author | Kim, JI | - |
| dc.date.accessioned | 2013-03-18T13:40:59Z | - |
| dc.date.available | 2013-03-18T13:40:59Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005 | - |
| dc.identifier.citation | ICEP 2005, v., no., pp.4 - 8 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/148941 | - |
| dc.language | ENG | - |
| dc.title | Overview of the Electronic Packaging Technologies in Korea | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 4 | - |
| dc.citation.endingpage | 8 | - |
| dc.citation.publicationname | ICEP 2005 | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Sohn, YC | - |
| dc.contributor.nonIdAuthor | Kim, JI | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.