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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

플립칩 접속을 위한 비전도성 필름 (NCFs)의 관능기가 물질 특성 및 신뢰성에 미치는 영향

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Paik, Kyung-Wookresearcher
Publisher
한국마이크로전자 및 패키징 학회
Issue Date
2005-11-01
Language
KOR
Citation

한국마이크로전자 및 패키징 학회, pp.37 - 44

URI
http://hdl.handle.net/10203/147092
Appears in Collection
MS-Conference Papers(학술회의논문)
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