전자패키징용 Au bonding wire의 본딩 강도에 미치는 열처리의 영향

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Publisher
금속재료학회
Issue Date
2006-04-27
Language
KOR
Citation

Spring Meeting of The Korean Institute of Metals and Materials

URI
http://hdl.handle.net/10203/146248
Appears in Collection
MS-Conference Papers(학술회의논문)
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