Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kang S.K. | - |
| dc.contributor.author | Lauro P. | - |
| dc.contributor.author | Shih D.-Y. | - |
| dc.contributor.author | Henderson D.W. | - |
| dc.contributor.author | Gosselin T. | - |
| dc.contributor.author | Bartelo J. | - |
| dc.contributor.author | Cain S.R. | - |
| dc.contributor.author | Goldsmith C. | - |
| dc.contributor.author | Puttlitz K.J. | - |
| dc.contributor.author | Hwang T.-K. | - |
| dc.date.accessioned | 2013-03-18T00:01:37Z | - |
| dc.date.available | 2013-03-18T00:01:37Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2004-06-01 | - |
| dc.identifier.citation | 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, no., pp.661 - 667 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/143013 | - |
| dc.language | ENG | - |
| dc.title | Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-10444286031 | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 1 | - |
| dc.citation.beginningpage | 661 | - |
| dc.citation.endingpage | 667 | - |
| dc.citation.publicationname | 2004 Proceedings - 54th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Hwang T.-K. | - |
| dc.contributor.nonIdAuthor | Kang S.K. | - |
| dc.contributor.nonIdAuthor | Lauro P. | - |
| dc.contributor.nonIdAuthor | Shih D.-Y. | - |
| dc.contributor.nonIdAuthor | Henderson D.W. | - |
| dc.contributor.nonIdAuthor | Gosselin T. | - |
| dc.contributor.nonIdAuthor | Bartelo J. | - |
| dc.contributor.nonIdAuthor | Cain S.R. | - |
| dc.contributor.nonIdAuthor | Goldsmith C. | - |
| dc.contributor.nonIdAuthor | Puttlitz K.J. | - |
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