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Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents

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Kang S.K. / Lauro P. / Shih D.-Y. / Henderson D.W. / Gosselin T. / Bartelo J. / Cain S.R. / Goldsmith C. / Puttlitz K.J. / Hwang T.-K.researcher

Issue Date: 2004-06-01

Language: ENG

Citation: 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.661 - 667

ISSN: 0569-5503

URI: http://hdl.handle.net/10203/143013

Appears in Collection: RIMS Conference Papers

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