Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents

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Issue Date
2004-06-01
Language
ENG
Citation

2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.661 - 667

ISSN
0569-5503
URI
http://hdl.handle.net/10203/143013
Appears in Collection
RIMS Conference Papers
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