Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs

Publisher
IEEE
Issue Date
2004-06-01
Language
ENG
Citation

Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.675 - 682

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1416
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
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