Characterization of coined solder bumps on PCB pads

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dc.contributor.authorNah, JWko
dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorKim, WHko
dc.contributor.authorHur, KRko
dc.date.accessioned2007-09-11T05:58:48Z-
dc.date.available2007-09-11T05:58:48Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2002-05-28-
dc.identifier.citation52nd Electronic Components and Technology Conference, pp.154 - 160-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1406-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleCharacterization of coined solder bumps on PCB pads-
dc.typeConference-
dc.identifier.wosid000176683800026-
dc.identifier.scopusid2-s2.0-0036290683-
dc.type.rimsCONF-
dc.citation.beginningpage154-
dc.citation.endingpage160-
dc.citation.publicationname52nd Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Diego, CA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorNah, JW-
dc.contributor.nonIdAuthorKim, WH-
dc.contributor.nonIdAuthorHur, KR-
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