Characterization of coined solder bumps on PCB pads

Publisher
IEEE
Issue Date
2002-05-28
Language
ENG
Citation

52nd Electronic Components and Technology Conference, pp.154 - 160

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1406
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
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