A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders
- Issue Date
- 2006-12-11
- Language
- ENG
- Citation
2006 International Conference on Electronic Materials and Packaging, EMAP, pp.571 - 579
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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