UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration

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Publisher
IEEE
Issue Date
2002-05-28
Language
ENG
Citation

52nd Electronic Components and Technology Conference, pp.1213 - 1220

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1403
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
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