Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs

Publisher
IEEE
Issue Date
2003-05-27
Language
ENG
Citation

53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1402
Appears in Collection
MS-Conference Papers(학술회의논문)
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