Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads

Publisher
IEEE
Issue Date
2001-05-29
Language
ENG
Citation

51st Electronic Components and Technology Conference, pp.790 - 795

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1400
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
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