Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications

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Issue Date
1999-05
Language
ENG
Citation

Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/1396
Appears in Collection
EE-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
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