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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications

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Kim, Jounghoresearcher / Paik, Kyung-Wookresearcher / Yim, M / Ryu, W / Jeon, Y
Publisher
Electronic Components and Technology Conference
Issue Date
1999-05
Language
English
Citation

Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/1396
Appears in Collection
EE-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
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