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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

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dc.contributor.authorYim, MJ-
dc.contributor.authorHwang, JS-
dc.contributor.authorKim, JG-
dc.contributor.authorKim, HJ-
dc.contributor.authorKwon, W-
dc.contributor.authorJang, KW-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2007-09-11T03:02:31Z-
dc.date.available2007-09-11T03:02:31Z-
dc.date.created2012-02-06-
dc.date.issued2004-06-01-
dc.identifier.citationProceedings - 54th Electronic Components and Technology Conference, v.1, no., pp.159 - 164-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1392-
dc.description.sponsorshipThis work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation.en
dc.languageENG-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleAnisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications-
dc.typeConference-
dc.identifier.scopusid2-s2.0-10444273987-
dc.type.rimsCONF-
dc.citation.volume1-
dc.citation.beginningpage159-
dc.citation.endingpage164-
dc.citation.publicationnameProceedings - 54th Electronic Components and Technology Conference-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorYim, MJ-
dc.contributor.nonIdAuthorHwang, JS-
dc.contributor.nonIdAuthorKim, JG-
dc.contributor.nonIdAuthorKim, HJ-
dc.contributor.nonIdAuthorKwon, W-
dc.contributor.nonIdAuthorJang, KW-
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MS-Conference Papers(학술회의논문)
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