DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kwak D.-K. | - |
dc.contributor.author | Lee H.-B. | - |
dc.contributor.author | Kang S.-W. | - |
dc.date.accessioned | 2013-03-17T02:17:12Z | - |
dc.date.available | 2013-03-17T02:17:12Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-10-16 | - |
dc.identifier.citation | 208th Meeting of The Electrochemical Society, v., no., pp.1179 - | - |
dc.identifier.issn | 1091-8213 | - |
dc.identifier.uri | http://hdl.handle.net/10203/138780 | - |
dc.language | ENG | - |
dc.title | Ultra thin copper film deposition by metal-organic chemical vapor deposition on ruthenium thin film | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-33645711678 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1179 | - |
dc.citation.publicationname | 208th Meeting of The Electrochemical Society | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Kang S.-W. | - |
dc.contributor.nonIdAuthor | Kwak D.-K. | - |
dc.contributor.nonIdAuthor | Lee H.-B. | - |
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