기판단위 밀봉 패키징을 위한 내압 동공열의 설계 및 강도평가

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Issue Date
1999-04-17
Language
KOR
Citation

제1회 MEMS 학술대회, pp.121 - 124

URI
http://hdl.handle.net/10203/131755
Appears in Collection
BiS-Conference Papers(학술회의논문)
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