하니컴형 성형촉매와 흡착제를 이용한 다이옥신 제거공정 개발

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dc.contributor.authorSon Ki Ihm-
dc.date.accessioned2013-03-16T12:48:59Z-
dc.date.available2013-03-16T12:48:59Z-
dc.date.created2012-02-06-
dc.date.issued2000-01-01-
dc.identifier.citation, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/131427-
dc.languageKOR-
dc.title하니컴형 성형촉매와 흡착제를 이용한 다이옥신 제거공정 개발-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorSon Ki Ihm-
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CBE-Conference Papers(학술회의논문)
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