Estimation of the interfacial fracture energy of metal/polymer system in microelectronic packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Song, JY | - |
| dc.contributor.author | Yu, Jin | - |
| dc.date.accessioned | 2013-03-16T09:44:35Z | - |
| dc.date.available | 2013-03-16T09:44:35Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-04-16 | - |
| dc.identifier.citation | 2001 MRS Spring Meeting, v.682, no., pp.150 - 155 | - |
| dc.identifier.issn | 0272-9172 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/130001 | - |
| dc.language | ENG | - |
| dc.title | Estimation of the interfacial fracture energy of metal/polymer system in microelectronic packaging | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-34249902304 | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 682 | - |
| dc.citation.beginningpage | 150 | - |
| dc.citation.endingpage | 155 | - |
| dc.citation.publicationname | 2001 MRS Spring Meeting | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Song, JY | - |
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