Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Paik, Kyung Wook

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Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications

Kim, Ji Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-15

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