Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Paik, Kyung-Wook

Showing results 1 to 31 of 31

1
A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry

Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03

2
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Jang, Kyung-Woon; Park, Jin-Hyoung; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1174 - 1181, 2012-06

3
A thermomechanical analysis of MCM-D substrate of polymer and metal multilayer

Lim, JH; Kim, JS; Paik, Kyung-Wookresearcher; Earmme, Youn-Youngresearcher, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2, v.183-1, pp.1123 - 1128, 2000

4
Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF

Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002

5
Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02

6
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

7
Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement

Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09

8
Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF)

Park, J.-H.; Chung, C.-K.; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, KEY ENGINEERING MATERIALS, v.326-328, no.0, pp.517 - 520, 2006

9
Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09

10
Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF(Chip-in-Flex) Packages at Humid Environments

Kim, Jihye; Lee, Tae-Ik; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, 2018 IEEE 68th Electronic Components and Technology Conference, IEEE-CPMT, 2018-05-31

11
Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-in-Flex (CIF) Packages for Wearable Electronics Applications

Kim, Jihye; Lee, Tae-Ik; Yoon, Dal Jin; Kim, Taek-Soo; Paik, Kyung-Wook, 2017 IEEE 67th Electronic Components and Technology Conference, IEEE-CPMT, 2017-06-01

12
Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-On-Board Interconnections

Chung, Chang-Kyu; Sim, Gidongresearcher; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.3, pp.359 - 366, 2012-03

13
Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards

Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007

14
Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package

Kim, Young-Lyong; Lee, Tae-Ik; Kim, Ji-Hye; Kim, Wonsik; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.200 - 207, 2016-02

15
Experimental investigation of thermal characteristics for a microchannel heat sink subject to an impinging jet, using a micro-thermal sensor array

Jang, Seokpil; Kim, Sung-Jinresearcher; Paik, Kyung-Wookresearcher, SENSORS AND ACTUATORS A-PHYSICAL, v.105, no.2, pp.211 - 224, 2003-07

16
Experimental Verification of Through-Thickness Strain Distribution in Flexible Devices Under Bending

Lee, Tae-Ik; Kim, Wansun; Jo, Woosung; Kim, Jihye; Paik, Kyung-Wookresearcher; Kim, Taek-Sooresearcher, 18th International Conference on Experimental Mechanics, European society for experimental mechanics, 2018-07-01

17
In-situ Moire Measurement of Adhesive Flip-Chip Bonded Assembly under Thermal Cycling Condition

Ham, SJ; Kwon, WS; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06

18
Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05

19
Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump

Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03

20
Moisture induced interface weakening in ACF package

Sim, Gidongresearcher; Chung, Chang-Kyu; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12

21
Numerical Analysis of Coined Eutectic Solder Bumps

Hwang, Tae-Kyung; Nah, Jae-Woong; Paik, Kyung-Wook; Lee, Soon-Bokresearcher, KSME 2002 Conference of Materials and Fracture Division, KSME 02MF025, pp.158 - 163, 2002

22
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Yang, SY; Jeon, YD; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02

23
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jinresearcher; Kim, Jong-Soo; Paik, Kyung-Wookresearcher, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06

24
The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10

25
Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications

Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jinresearcher; Paik, Kyung-Wookresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10

26
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation

Kwon, WS; Yim, MJ; Paik, Kyung-Wookresearcher; Ham, SJ; Lee, Soon-Bokresearcher, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06

27
Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications

Son, Ho-Young; Kim, Ilho; Lee, Soon-Bokresearcher; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wookresearcher, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01

28
Thermomechanical stress analysis of laminated thick-film multilayer substrates

Kim, JS; Paik, Kyung-Wookresearcher; Lim, JH; Earmme, Youn-Youngresearcher, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06

29
Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications

Kim, J.-H; LEE, TAE-IK; Shin, J.-W; Kim, Taek-Soo; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-28

30
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

31
Warpage behavior of chip-on-flex(COF) package under thermal cycling condition

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bokresearcher, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11

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