Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Paik, Kyung Wook

Showing results 1 to 3 of 3

1
Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding

Kim, Tae Wan; Lee, Tae Ik; Lee, Sang Hoon; Kim, Taek Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-14

2
The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji Hye; Lee, Tae Ik; Kim, Taek Sooresearcher; Paik, Kyung Wookresearcher, 66th Electronic Components and Technology Conference, pp.1583 - 1591, Electronic Components and Technology Conference, 2016-06-01

3
Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications

Kim, Ji Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-15

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