DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jeon, YD | ko |
dc.contributor.author | Nieland, S | ko |
dc.contributor.author | Ostmann, A | ko |
dc.contributor.author | Reichl, H | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-04T09:00:08Z | - |
dc.date.available | 2007-09-04T09:00:08Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2002-05-28 | - |
dc.identifier.citation | 52nd Electronic Components and Technology Conference, pp.740 - 746 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1296 | - |
dc.description.sponsorship | "This work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation." | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy | - |
dc.type | Conference | - |
dc.identifier.wosid | 000176683800117 | - |
dc.identifier.scopusid | 2-s2.0-0036290937 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 740 | - |
dc.citation.endingpage | 746 | - |
dc.citation.publicationname | 52nd Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Diego, CA | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Jeon, YD | - |
dc.contributor.nonIdAuthor | Nieland, S | - |
dc.contributor.nonIdAuthor | Ostmann, A | - |
dc.contributor.nonIdAuthor | Reichl, H | - |
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