Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

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Issue Date
1999-10-18
Language
ENG
Citation

Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999), pp.421 - 425

ISSN
1089-8190
URI
http://hdl.handle.net/10203/125699
Appears in Collection
EE-Conference Papers(학술회의논문)
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