Locally heated low temperature wafer level mems packaging with closed-loop AuSn solder-lines

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Issue Date
2002-11-17
Language
ENG
Citation

ASME 2002 International Mechanical Engineering Congress and Exposition, IMECE2002, pp.33 - 37

URI
http://hdl.handle.net/10203/125558
Appears in Collection
BiS-Conference Papers(학술회의논문)
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