Exothermic reaction induced eutectic Pb-Sn solder ball melting in the underfill curing process

The effects of exothermic heat generated during underfill curing on the integrity of the solder bumped package, which is an important issue for the package reliability, have been overlooked. In this study, theoretical exotherm of underfill materials during underfill curing has been calculated using a differential scanning calorimeter (DSC) at cure temperature range from 100 degreesC to 200 degreesC. The calculated exotherm was compared with the exotherm profile measured at the typical cure temperature. The effects of cure temperature, amount of underfill, and initial underfill curing temperature on the exotherm profile of underfill materials have been investigated.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2004-03
Language
ENG
Keywords

RELIABILITY

Citation

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.172 - 176

ISSN
1521-3331
DOI
10.1109/TCAPT.2004.825753
URI
http://hdl.handle.net/10203/1240
Appears in Collection
MS-Journal Papers(저널논문)
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