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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Grain morphology of intermetallic compounds at solder joints

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dc.contributor.authorChoi, WKko
dc.contributor.authorJang, SYko
dc.contributor.authorKim, JHko
dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorLee, HyuckMoko
dc.date.accessioned2007-09-03T06:11:59Z-
dc.date.available2007-09-03T06:11:59Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2002-03-
dc.identifier.citationJOURNAL OF MATERIALS RESEARCH, v.17, no.3, pp.597 - 599-
dc.identifier.issn0884-2914-
dc.identifier.urihttp://hdl.handle.net/10203/1233-
dc.description.abstractThe grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu,Sn5 grains on Cu substrates were rough or rounded, and Ni3Sn4 grains on Ni substrates were faceted. Through the energy-based calculations, the relationship between the IMC grain morphology and Jackson's parameter alpha was explained. The Jackson's parameter of the IMC grain with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.-
dc.description.sponsorshipThis study was supported by the Center for Electronic Packaging Materials of the Korea Science and Engineering Foundation.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherMATERIALS RESEARCH SOCIETY-
dc.subjectEUTECTIC SNPB SOLDER-
dc.subjectINTERFACIAL REACTION-
dc.subjectCU SUBSTRATE-
dc.subjectNI-
dc.subjectSN-3.5AG-
dc.subjectSYSTEM-
dc.subjectALLOY-
dc.subjectFOILS-
dc.subjectTIME-
dc.titleGrain morphology of intermetallic compounds at solder joints-
dc.typeArticle-
dc.identifier.wosid000174300000014-
dc.identifier.scopusid2-s2.0-0036507250-
dc.type.rimsART-
dc.citation.volume17-
dc.citation.issue3-
dc.citation.beginningpage597-
dc.citation.endingpage599-
dc.citation.publicationnameJOURNAL OF MATERIALS RESEARCH-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.localauthorLee, HyuckMo-
dc.contributor.nonIdAuthorChoi, WK-
dc.contributor.nonIdAuthorJang, SY-
dc.contributor.nonIdAuthorKim, JH-
dc.type.journalArticleArticle-
dc.subject.keywordPlusEUTECTIC SNPB SOLDER-
dc.subject.keywordPlusINTERFACIAL REACTION-
dc.subject.keywordPlusCU SUBSTRATE-
dc.subject.keywordPlusNI-
dc.subject.keywordPlusSN-3.5AG-
dc.subject.keywordPlusSYSTEM-
dc.subject.keywordPlusALLOY-
dc.subject.keywordPlusFOILS-
dc.subject.keywordPlusTIME-
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