Grain morphology of intermetallic compounds at solder joints

The grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu,Sn5 grains on Cu substrates were rough or rounded, and Ni3Sn4 grains on Ni substrates were faceted. Through the energy-based calculations, the relationship between the IMC grain morphology and Jackson's parameter alpha was explained. The Jackson's parameter of the IMC grain with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.
Publisher
MATERIALS RESEARCH SOCIETY
Issue Date
2002-03
Language
ENG
Keywords

EUTECTIC SNPB SOLDER; INTERFACIAL REACTION; CU SUBSTRATE; NI; SN-3.5AG; SYSTEM; ALLOY; FOILS; TIME

Citation

JOURNAL OF MATERIALS RESEARCH, v.17, no.3, pp.597 - 599

ISSN
0884-2914
URI
http://hdl.handle.net/10203/1233
Appears in Collection
MS-Journal Papers(저널논문)
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