DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, KW | ko |
dc.contributor.author | Kim, HJ | ko |
dc.contributor.author | Yim, MJ | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-03T05:37:01Z | - |
dc.date.available | 2007-09-03T05:37:01Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006-05-30 | - |
dc.identifier.citation | IEEE 56th Electronic Components and Technology Conference, pp.918 - 923 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1225 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection | - |
dc.type | Conference | - |
dc.identifier.wosid | 000238566600141 | - |
dc.identifier.scopusid | 2-s2.0-33845583525 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 918 | - |
dc.citation.endingpage | 923 | - |
dc.citation.publicationname | IEEE 56th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Diego, CA | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Lee, KW | - |
dc.contributor.nonIdAuthor | Kim, HJ | - |
dc.contributor.nonIdAuthor | Yim, MJ | - |
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