Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection

Publisher
IEEE
Issue Date
2006-05-30
Language
ENG
Citation

IEEE 56th Electronic Components and Technology Conference, pp.918 - 923

URI
http://hdl.handle.net/10203/1225
Appears in Collection
MS-Conference Papers(학술회의논문)
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