Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications

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Publisher
IEEE
Issue Date
2006-05-30
Language
ENG
Citation

IEEE 56th Electronic Components and Technology Conference, pp.338 - 343

URI
http://hdl.handle.net/10203/1221
Appears in Collection
MS-Conference Papers(학술회의논문)
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